STP-XA2703C

The STP-XA2703C turbo pump offers high performance in the process range of high vacuum to 2300 sccm process flow with enhanced throughput for all gases.

This pump is based on a new platform design offering features to improve thermal management, which enhances performance on harsh processes, increases the maximum process flow capability and reduces the effects of corrosion and deposition.

The outstanding performance is suited to both light and harsh applications, such as semiconductor etch, implant, lithography and LCD processes.

Features and Benefits

• Advanced rotor design 

         Increased H2, N2 and Ar performance
         Improved performance in the process pressure range of high vacuum to 2300 sccm
         Maintenance free

• 5-axis magnetic suspension system 

         Zero contamination
         Low vibration

• Innovative torque management 

         Patented torque reduction mechanism

• Optimized temperature management 

         High temperature TMS capability
         Low deposition
         Built-in cooling mechanism
         Higher gas throughput heated and unheated
         Optimized life
         Harsh process compatible

• Certifications 

         SEMI® compliant, CE Marked and UL Listed

Applications

• Plasma etch (chlorine, fluorine and bromine chemistries) for metal (aluminum), tungsten and dielectric (oxide) and polysilicon
• Electron cyclotron resonance (ECR) etch
• Film deposition CVD, PECVD, ECRCVD, MOCVD
• Sputtering
• Ion implantation source, beam line pumping end station
• MBE
• Diffusion
• Photo resist stripping
• Crystal/epitaxial growth
• Wafer inspection
• Load lock chambers
• Scientific instruments: surface analysis, mass spectrometry, electron microscopy
• High energy physics: beam lines, accelerators
• Radioactive applications: fusion systems, cyclotrons