STP-iXA2206C
The STP-iXA2206 series magnetically levitated turbomolecular pump provides industry-leading performance and incorporates a small power supply into the onboard control unit – the latest technology of the well-established STP-iXA2205 series. The height of the pump is equal to the STP-A2203C and is also equal to the height of the STP-iXA2205 series without it’s power supply (iPS-1200). This fully integrated product offers easy installation and a small footprint as an all-in-one solution for all application tools.
Features and Benefits
- Compact design including a fully integrated controller
- Innovative, self-sensing magnetic bearing system
- Digital 5-axis control
- Vibration levels reduced by 50% compared to the existing turbo pumps
- Can be configured to run corrosive processes
Applications
- Plasma etch (chlorine, fluorine and bromine chemestries) for metal (aluminium), tungsten and dialectric (oxide) and polysilicon
- Electron cyclotron resonance (ECR) etch
- Film deposition CVD, PECVD, ECRCVD, MOCVD
- Sputtering
- Ion implantation source, beam line pumping and station
Inlet flange size | ISO250F/VG250/ICF305 |
Backing port size | KF40 |
Pump speed N2/Ar | 2200/1900 ls-1 |
Compression ratio N2/H2 | >108 / 1 x 104 |
Ultimate pressure | 10-7 Pa (10-9 Torr) |
Allowable backing pressure | 266 Pa (2 Torr) |
Max gas flow N2 * (water cooled only) | 3000 sccm |
(5.07 Pam3s-1) | |
Max gas flow Ar * (water cooled only) | 1400 sccm |
(2.36 Pam3s-1) | |
Rated speed | 27000 rpm |
Run-up time to 90% rated speed | <8 minutes |
Mounting position | Any orientation |
Input voltage | 200-240 V |
Max input power (without TMS) | 1200 VA |
Weight | 62 kg |
* The maximum gas flow is applicable under conditions that N2 or Ar gas is pumped continuously with water cooling temperature between 15-25 °C and the backing pump (10,000 l/min size) is used. It is changed on condition.