Designed for low cost-of-ownership, the Sirius 6000 system addresses greenhouse gas abatement challenges arising from dielectric and polysilicon etch processes used in semiconductor manufacturing. Its innovative design uses an energy efficient microwave plasma in a carefully controlled chemical environment and an integrated wet scrubber to reduce fab greenhouse gas emissions by as much as 95 percent over a wide range of total flow rates and perfluorocompound (PFC) concentrations.
Plasma abatement has a significantly lower cost-of-ownership than fueled abatement, resulting from lower costs for energy, consumables and maintenance. At the same time, its high-density plasma delivers more energy to the abatement process itself, ensuring effective destruction of both greenhouse gases and potentially toxic by-products. The plasma reduces PFC gases to hydrogen fluoride (HF) and prevents the creation of harmful by-products, such as carbon tetrafluoride (CF4). The hydrofluoric acid and any other remaining byproducts are then removed from the exhaust stream in the integrated wet scrubber, preventing harmful emissions from reaching the atmosphere.
Features and Benefits
- Low cost of ownership
low energy consumption
Economical for service
- Low equivalent CO2 emissions
Low power and utility usage
- High performance to power ratio
Greater Destruction and Removal Effiency (DRE) per unit energy